Technical Bulletin: Microvia 0.50mm (19.7mil) Feature Pitch
With their potential to free-up valuable PCB real estate as well as improve electrical performance, 0.50mm pitch devices are a useful design option. However, implementing them successfully requires a concerted effort between the designer and the PCB fabricator. The tighter geometry introduces additional manufacturing considerations which, if left unaddressed, may impact product quality. This bulletin provides design guidance for 0.50mm pitch devices from the PCB manufacturing perspective.
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Technical Bulletin: RoHS and the Printed Circuit Board
Compliance with the European Union's directive 2002/95/EC regarding the Restriction of Hazardous Substances (RoHS) requires partnering throughout your supply chain. Understanding your needs for a printed circuit board (PCB) relative to the RoHS directive will ensure you manage compliance in this segment of your supply chain in the most efficient, cost effective manner possible. This bulletin discusses the RoHS directive as it pertains to an unpopulated circuit board.
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Technical Bulletin: Microvia 1 mm Feature Pitch
Larger module/BGA footprints are driving the need to increase lines per channel for connection escape if routing is to be achieved without the addition of signal layers. Standard Thru-Hole technology does not provide adequate pad-to-pad spacing within the 1 mm module/BGA site for more than 2 lines per channel routing. Replacing Thru-Hole connections with microvias enables increased routing while maintaining the original layer count. This technical bulletin discusses application of standard microvias with 1mm pitch devices and the associated manufacturing considerations.
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Technical Bulletin: Copper Filled Microvias
Increasing interconnect density from higher pin count and tighter pitch I/O devices has driven new approaches in Interconnect Structures design and manufacturing. Fully plating microvias brings an Interconnect Structures solution with two major advantages: providing a planar surface for via-in-pad applications and enabling increased routing density through "stacked" constructions. This technical bulletin discusses application of copper filled microvias and the associated manufacturing considerations.
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Technical Bulletin: Back-Drilling
Removing the unused portion of copper plating from the barrel of plated Thru-Holes used to route high speed signals has been shown to improve signal quality by reducing attenuation. Back-drilling, as it is commonly known, is the process used to remove the unused portion of the copper plated barrel. Historically back-drilling has been used primarily on back panels, but ever increasing speeds and improved signal quality requirements have driven the need to utilize it on the active PCBs as well. This technical bulletin discusses the application of back-drilling and the associated manufacturing considerations.
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