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| Data Package Checklist |
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| Data Elements |
- Inner and outer layer data (all copper layers)
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Soldermask layers
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Legend layers
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Aperture list if apertures are not embedded in the Gerber data (RS-274X)
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Drill file with tool codes and X-Y coordinates of all holes in either ASCII or EIA format
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IPC 356 netlist or mentor graphics neutral file
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A readme file that contains an engineering contact and any special instructions
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| blue print elements |
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Drawing in Gerber, HPGL, PDF, DXF format, or hardcopy
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Board outline dimensions including cutouts, chamfers, radii, bevels, scores, etc.
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Dimension from a reference hole in the board to a corner or to two sides of the board outline
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A hole chart with the hole symbols on the drawing and the finished hole sizes
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Material requirements
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Finished board thickness and tolerance
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Layer stack-up order
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Controlled impedance requirements (if applicable)
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Dimensioned array drawing if the design is to be shipped as a multiple -up array
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Notes defining any other requirements or specifications pertinent to the design
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| readme file |
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Engineering contact (email and phone)
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Purchasing contact (email and phone)
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Quantity desired (if submitted for quotation)
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Turn-time in days (if submitted for quotation)
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