IC substrates serve as the connection between IC chip(s) and the PCB through a conductive network of traces and holes. IC substrates support critical functions including circuit support and protection, heat dissipation, and signal and power distribution

IC substrates represent the highest level of miniaturization in PCB manufacturing and shares many similarities with semiconductor manufacturing. TTM produces many types of IC substrates on which IC chip(s) are attached to the IC substrate utilizing wire bonding and, or flip chip methods. Advanced technology IC substrates that TTM manufactures include:

CSP (Chip Scale Packages) FC-CSP (Flip Chip) CSP BOC (Board on Chip) PoP (Package on Package) PiP (Package in Package) SiP (System in Package) RF module
Advanced Capabilities: Minimum line width and spacing: 20/20 µm Minimum laser via/pad: 75/150 µm Bump pad: Minimum 180 µm bump pitch Bump material: SAC305 Structure: any layer, coreless, cavity Wide material and surface finish options available