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Products
 
PCB Fabrication Capabilities
Rigid PCBs
Flex & Rigid-Flex
Specialty Products
 rigid pcbs flex & rigid-flex specialty products
  • 4 to 60+ Layers
  • Wide Laminate Selections
  • Mixed Dielectric (Hybrid) Constructions
  • Panel Size up to 30"x 55"
  • RF and High Performance Designs
  • Heavy Copper (10 oz. - .100)
  • Buried Resistance and Capacitance
  • Constrained Core MLB
  • HDI Microwave
  • 2-30+ Layer Capability
  • Types 1, 2, 3 & 4
  • MIL-SPEC & UL Qualified
  • Acrylic, Epoxy and Adhesiveless Polyimide
  • Custom Surface Finishes Available
  • Military and Aerospace Certifications
  • 1 - 68 Layers
  • High Frequency (RF) Bandwidth Designs
  • Buried Metal Core Construction
  • Surface Mounted Heatsinks
 
Assembly Capabilities Standard Product
Integrated Assembly
Backplanes
 backplanes integrated assembly standards based
  • Press-fit (Compliant - pin)
  • Military QPL (MIL-28870)
  • Compression Mount
  • Wave / Selective Solder
  • Up to 48" x 36"
  • .400"+ PCB Thickness
  • AOI of Connectors / Pins
  • X-Ray Inspection
  • Level 2/3 Testing (to 44k test points)
  • Design Services
  • Card-Cage thru Cabinet
  • Backplanes / Midplanes
  • ATR (ARINC) Interfaces
  • Peripheral Components
  • Power Supplies
  • Fan Trays / Heatsinks
  • Harnessing / Cabling
  • Functional Testing
  • Design Services
  • VME / VME64x
  • VITA41 (VXS)
  • VITA46 (VPX)
  • CompactPCI*
  • AdvancedTCA*
  • microTCA*
 
Assembly Capabilities Specialty Product
Rigid-Flex
RF/Microwave
Heat-Sink Assemblies
 rigid-flex rf/microwave heat-sink assemblies
  • Press-Fit, SMT & Thru-Hole Assembly
  • MIL-Spec, Types 1,2,3,4
  • Up to 36" x 24"
  • Heavy Copper (High Current Configs.)
  • Passive/Active Comps.
  • Integration w/ Rigid PCBs
  • AOI Inspection
  • X-Ray Inspection
  • Level 2/3 Testing (to 44k test points)
  • Design Services
  • 1-Piece Hermetic SMP / SMPM
  • Blind Solder Interconnect
  • Up to 36" x 24" PCBs via Automated Assembly
  • X-Ray Testing
  • RF Testing
  • Internal & External, Cu & Al Construction
  • Prepreg & Adhesives (Thermally or Electrically Conductive)
  • Integrated w/ SMT, Press-Fit & Thru-Hole Component Technologies

 

*The CompactPCI, AdvancedTCA and microTCA names are trademarks of PCI Industrial Computer Manufacturers Group.